VEQTER is the exclusive, Worldwide, commercial provider of the Deep-Hole Drilling residual stress measurement technique. The deep-hole drilling technique is the only truly portable measurement technique that can measure residual stresses within a component (simple or complex in geometry) at depths greater than 10mm below the surface.

We are also able to utilise a portfolio of other residual stress measurement techniques, such as: Crack Compliance, Incremental Centre Hole Drilling, Neutron Diffraction, Sachs Boring, Synchrotron X-ray, and X-ray.

Complete through thickness distributions are required for accurate/realistic fracture mechanics calculations and for determining component distortions.

Our project team have been carrying out residual stress measurements as part of real component applications for over 10 years and have therefore built-up extensive experience from a range of complex shaped components. Based on this experience we advise clients on the most effective route for stress measurement and consultation on effective stress mapping, modelling, redistribution and failure analysis techniques as required.

Using our portfolio of techniques we can record a large number of measurement data points through the complete thickness of a component. The large data set recorded allows for a more accurate evaluation of the stress levels and gradients acting at any point within the component.

At our laboratory facilities we are able to manipulate and test components weighing up to 3 tonnes. However , should it be impractical to transport your component to us, “on-site” measurements can be carried out.

VEQTER carries out residual stress measurements anywhere in the World.

Our range of specialist machines are capable of measuring the residual stresses experienced by components at depths from 10μm to 750mm below the surface.